Electromigration Modeling for Interconnect Structures in Microelectronics

Electromigration in Interconnect Structures of Microelectronics Circuits

We present a comprehensive physical model for the whole life cycles of electromigration induced voids. Special emphasis is put on explaining the void morphology and its impact on interconnect resistance. Investigations for common twoand three-dimensional interconnect structures are presented. Implications of the theoretical analysis and the simulation results for modern interconnect design are ...

Application of three-parameter lognormal distribution in EM data analysis

Three-parameter lognormal distribution has been demonstrated for applications in electromigration data analysis, especially for Cu interconnect structures with insufficient redundancy. Examples are given on estimating parameter values from experimental data using the maximum likelihood method. Detailed analyses are presented on confidence bound estimations of the parameters and their propagatio...

Computer Simulation of ElectroMigration in Microelectronics Interconnect

Effects of width scaling and layout variation on dual damascene copper interconnect electromigration

Electromigration versus line width in the 0.12–10 lm range and the configuration of the via/line contact in dual damascene Cu has been investigated. There are two scenarios for width scaling impact on electromigration. One is the width < 1 lm region, in which the MTF shows a weak width dependence, except for the via-limited condition. The other is the width > 1 lm region, in which the MTF shows...

Physically based models of electromigration: From Black's equation to modern TCAD models

Electromigration failure is a major reliability concern for integrated circuits. The continuous shrinking of metal line dimensions together with the interconnect structure arranged in many levels of wiring with thousands of interlevel connections, such as vias, make the metallization structure more susceptible to failure. Mathematical modeling of electromigration has become an important tool fo...